Credit: TECNO
TL;DR
- TECNO will showcase an ultra-thin modular phone concept at MWC 2026.
- The concept is designed to let users snap hardware modules onto a phone without turning it into a bulky brick.
- The base phone itself is superthin at just 4.9mm, and the company says attachments should still keep its profile competitive with conventional slab phones.
Modular smartphones never really made it mainstream, but TECNO is taking another swing at the concept with a focus on ultra-thin design.