TL;DR
- xMEMS is showing off its µCooling system that uses ultrasonic speakers to move air.
- The system is silent, water-resistant, and can small enough to be used in wearables.
- A ducted µCooling solution for phones could move up to 0.1 cubic feet of air a minute.
Heat is arguably the biggest enemy of modern processors. We can build incredibly fast chips, but run them too fast, and they’re going to start to melt down. As a result, nearly every device we use has to make some sort of balance between performance and thermal emissions. This year at CES in Las Vegas, we’re learning about an innovative new way that xMEMS is trying to tackle that problem, giving even compact mobile devices another option for staying cool.
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