Qualcomm’s Snapdragon 8 Elite promises big things for late 2024 and 2025 flagship smartphones. From a new custom CPU to unrivaled graphics performance, photography, and enhanced AI capabilities, it’s the chip that claims to do it all, and, for the most part, it does. However, our initial impressions of the chip have been tainted by exceedingly high temperatures when placed under stress.
First, the realme GT7 Pro overheated during benchmark tests. Even after a patch to address a “software compatibility issue” with 3DMark, the handset still hit a 47.7°C internal temperature, making for a phone that’s uncomfortable to hold when running full tilt. Next, the admirably performing ASUS ROG Phone 9 remained cool in its default performance mode but saw considerable performance throttling to keep those temperatures at a cool 34.9°C. Left unleashed in “X-Mode,” the phone recorded a scorching 55.8°C (admittedly just about as hot as last year’s model), though its robust cool solution kept performance steady. There’s a reason ASUS recommends a cooler accessory for longer gaming sessions.